Cohesive Zone Parameters for a Cyclically Loaded Copper-Epoxy Molding Compound Interface-Reference-Cited by-同舟云学术

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Cohesive Zone Parameters for a Cyclically Loaded Copper-Epoxy Molding Compound Interface

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Samet David,Kwatra Abhishek,Sitaraman Suresh K.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545550.pdf?arnumber=7545550

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