Investigation on memory package crack and prevention under temperature cycling test-Reference-Cited by-同舟云学术

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Investigation on memory package crack and prevention under temperature cycling test

Published:2024-09 Issue: Volume:180 Page:108560
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Che Fa Xing^ORCID,Ong Yeow Chon,Ng Hong Wan,Gan C.L.,Kumar Gokul

Publisher

Elsevier BV

Reference15 articles.

1. Substrate copper trace crack characterization and simulation;Yu,2023

2. Study on substrate crack through experiment and simulation on SSD BGA under temperature cycling test;Yu,2022

3. Failure mechanism and prevention of die cracking for FBGA package misplaced in the tray;Che,2021

4. Study on package strength of uMCP (multichip package) for mobile application through three-point bending test and simulation;Che,2020

5. Development on fatigue life model of lead-free solder for first failure prediction;Che,2022

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