Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP-Reference-Cited by-同舟云学术

Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Shen Wen-Wei,Lin Yu-Min,Chang Hsiang-Hung,Kuo Tzu-Ying,Fu Huan-Chun,Lee Yuan-Chang,Lee Shu-Man,Lin Ang-Ying,Huang Shin-Yi,Chang Tao-Chih,Lee Alvin,Su Jay,Huang Baron,Bai Dongshun,Liu Xiao,Chen Kuan-Neng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999668.pdf?arnumber=7999668

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