Warpage Estimation of Heterogeneous Panel-Level Fan-Out Package with Fine Line RDL and Extreme Thin Laminated Substrate Considering Molding Characteristics-Reference-Cited by-同舟云学术

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Warpage Estimation of Heterogeneous Panel-Level Fan-Out Package with Fine Line RDL and Extreme Thin Laminated Substrate Considering Molding Characteristics

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Lee Chang-Chun,Wang Chi-Wei,Lee Chia-Chi,Chen Chin-Yi,Chen Yu-Hua,Lee Hung-Chih,Chou Tsun-Sheng

Funder

Ministry of Science and Technology (MOST)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501520.pdf?arnumber=9501520

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fan-out panel-level package warpage and reliability analyses considering the fabrication process;Journal of Manufacturing Processes;2024-06

2. Analyzing the Influence of RDL Stack-up on Wafer Warpage in FOWLP through Experimental and Numerical Investigations;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review;Micromachines;2024-03-22

4. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

5. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

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