An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications-Reference-Cited by-同舟云学术

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An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Lin Yu-Min,Wu Sheng-Tsai,Wang Chun-Min,Lee Chia-Hsin,Huang Shin-Yi,Lin Ang-Ying,Chang Tao-Chih,Lin Puru Bruce,Ko Cheng-Ta,Chen Yu-Hua,Su Jay,Liu Xiao,Prenger Luke,Chen Kuan-Neng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811283.pdf?arnumber=8811283

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Influence of Temporary Rigid Carrier Structure on Warpage during Wafer/Panel level packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. A Warpage Investigation for a Large Panel-sized Interposer with Embedded Dies;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. A strategy to prepare low-temperature curable photosensitive polyimide with good comprehensive performance;Chemical Engineering Journal;2023-12

5. Laser debonding application in ultra-thin device processing;Applied Optics;2023-08-02

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