Development of 3D Thin WLCSP Using Vertical Via Last TSV Technology with Various Temporary Bonding Materials and Low Temperature PECVD Process-Reference-Cited by-同舟云学术

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Development of 3D Thin WLCSP Using Vertical Via Last TSV Technology with Various Temporary Bonding Materials and Low Temperature PECVD Process

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Xiao Zhiyi,Fan Jun,Ren Yulong,Li Yang,Huang Xiaohua,Yu Daquan,Zhang Wei

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545448.pdf?arnumber=7545448

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

2. Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies;Microsystem Technologies;2021-06-29

3. Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process;Materials Science in Semiconductor Processing;2021-03

4. Fan-In Wafer/Panel-Level Chip-Scale Packages;Semiconductor Advanced Packaging;2021

5. Development of 3D WLCSP with Black Shielding for Optical Finger Print Sensor for the Application of Full Screen Smart Phone;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

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