1. Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch;Zhao;ECS Transactions,2012
2. Thin wafer handling technologies for layer transfer processes in high-brightness led manufacturing;Ram;Semicon WEST,2011
3. Development of 3D thin WLCSP using vertical via last TSV technology with various temporary bonding materials and low temperature PECVD process;Xiao;IEEE 66th Electronic Components and Technology Conference,2016
4. Temporary Wafer Bonding Materials and Processes, International Microelectronics Assembly and Packaging Society (IMAPS) 8th International Conference and Exhibition on Device Packaging;Lueck,2012
5. Cost-effective Temporary Bonding and Debonding Material Solution towards High-Volume Manufacturing 2.5D/3D Through-Silicon via Integrated Circuits, 13 IEEE International 3D Systems Integration Conference (3DIC);Civale,2013