Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process-Reference-Cited by-同舟云学术

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Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process

Published:2022-12-16 Issue:2 Volume:35 Page:153-159
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Enomoto Tetsuya¹,Miyazawa Emi¹,Akasu Yuta¹,Sobue Shogo²,Nakamura Yuki²,Kawamori Takashi¹

Affiliation:

1. Organic Materials Research Department, Advanced Technology Research & Development Center, Research & Innovation Promotion Headquarters, Showa Denko Materials Co., Ltd.

2. Packaging Materials Research & Development Department, Information & Communication Research & Development Center, Information & Communication Business Headquarters, Showa Denko Materials Co., Ltd.

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/35/2/35_153/_pdf

Reference22 articles.

1. 1. Z. Dong and Y. Lin, Mater. Sci. Semicond. Process, 105 (2020) 104681.

2. 2. Y. Arimitsu, J. Adhesion Soc. Jpn., 44 (2008) 26.

3. 3. Y. Ohyama, J. Rubber Soc. Jpn., 78 (2005) 441.

4. 4. T. Inada and M. Kume, J. Rubber Soc. Jpn., 85 (2012) 26.

5. 5. P. Montmeat, L. Bally, T. Enot, and F. Fournel, Mater. Sci. Semicond. Process, 123 (2021) 105550.

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1. Highly Functional Materials for Advanced Package;Journal of Photopolymer Science and Technology;2024-06-25

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