Author:
Tsai Mike,Lan Albert,Shih Chi Liang,Huang Terence,Chiu Ryan,Chung S. L.,Chen J. Y.,Chu Frank,Chang Cheng Kai,Yang Sheng Ming,Chen Daniel,Kao Nicholas
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Thermal stress and drop stress analysis based on 3D package reliability study;Microelectronics Reliability;2023-02
2. System-in-Package (SiP);Semiconductor Advanced Packaging;2021
3. Innovative Packaging Solutions of 3D Integration and System in Package for IoT/Wearable and 5G Application;2019 IEEE 21st Electronics Packaging Technology Conference (EPTC);2019-12
4. Innovative System in Package Design by Laser Ablation Technology;2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2019-10
5. Advanced Antenna Integration of 3D System in Package Solutions for IoT and 5G Application;2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC);2019-09