Author:
Tsai Mike,Chiu Ryan,He Eric,Chen J. Y.,Chu Frank,Tsai Jensen,Wang Yu-Po,Jian Shunyu,Chen Simon
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Laser-assist 3D Selective Structuring on SiP Module AiP Application;2023 International Conference on Electronics Packaging (ICEP);2023-04-19