Innovative Packaging Solutions of 3D Integration and System in Package for IoT/Wearable and 5G Application-Reference-Cited by-同舟云学术

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Innovative Packaging Solutions of 3D Integration and System in Package for IoT/Wearable and 5G Application

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Author:

Lian Frank,Wang David,Chiu Ryan,Jiang Jase,Wang Yu-Po

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026573.pdf?arnumber=9026573

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-k Dielectric for Semiconductor Packaging: Advancements, Challenges, and Future Outlook;Handbook of Emerging Materials for Semiconductor Industry;2024

2. Modeling of Practical Substrate Thickness in Multilayer Printed Circuit Board for Millimeter-Wave Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04

3. Space-Borne System-in-Package Based on High Reliability Microwave Interconnections;Electronics;2023-02-24

4. Thermal stress and drop stress analysis based on 3D package reliability study;Microelectronics Reliability;2023-02

5. Quantum AI and IoT Cognitive Disease Data Security to Evade Quantum Computing Attacks;Bio-Inspired Algorithms and Devices for Treatment of Cognitive Diseases Using Future Technologies;2022-02-11

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