Reference159 articles.
1. Tsai, M., R. Chiu, D. Huang, F. Kao, E. He, J. Chen, S. Chen, J. Tsai and Y. Wang, “Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application”, IEEE/ECTC Proceedings, May 2019, pp. 700–706.
2. Liu, C., J. Chien, Y. Tseng, K. Liao, A. Chan, D. Chen, M. Shih, and M. Gerber, “Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding”, IEEE/ECTC Proceedings, May 2019, pp. 1902–1908.
3. Milton, B., A. Shah, H. Xu, O. Kwon, G. Schulze, I. Qin, and N. Wong, “Smart Wire Bond Solutions for SiP and Memory Packages”, IEEE/ECTC Proceedings, May 2019, pp. 55–62.
4. Talebbeydokhti, P., S. Dalmia, T. Thai, S. Tal, and R. Sover, “Ultra Large Area SIPs and Integrated mmW Antenna Array Module for 5G mmWave Outdoor Applications”, IEEE/ECTC Proceedings, May 2019, pp. 294–299.
5. Dalmia, S., K. Nahalingam, S. Vijayakumar, and P. Talebbeydokhti, “A Zero Height Small Size Low Cost RF Interconnect Substrate Technology for RF Front Ends for M.2 Modules and SiP”, IEEE/ECTC Proceedings, pp. 1666–1671.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. MOM: Microphone based 3D Orientation Measurement;2022 21st ACM/IEEE International Conference on Information Processing in Sensor Networks (IPSN);2022-05