Ultra Large Area SIPs and Integrated mmW Antenna Array Module for 5G mmWave Outdoor Applications

Author:

Talebbeydokhti Pouya,Dalmia Sidharth,Thai Trang,Sover Raanan,Tal Sharon

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Strategies for avoiding delamination in system-in-packaging devices;Microelectronic Engineering;2023-09

2. A RF Redundant TSV Interconnection for High Resistance Si Interposer;Micromachines;2021-02-08

3. System-in-Package (SiP);Semiconductor Advanced Packaging;2021

4. Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-09

5. Innovative EMI Shielding Solutions on Advanced SiP Module for 5G Application;2019 IEEE 21st Electronics Packaging Technology Conference (EPTC);2019-12

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