Strategies for avoiding delamination in system-in-packaging devices-Reference-Cited by-同舟云学术

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Strategies for avoiding delamination in system-in-packaging devices

Published:2023-09 Issue: Volume:281 Page:112089
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Alaferdov Andrei,Yoshioka Ricardo T.,Nunes Carolina C.P.,Sousa Matheus Dias,Carvalho Valdeci,Namba Igor Fernandes,Coral Claudemir

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. 3D integrated eWLB /FO-WLP technology for PoP & SiP;Lin,2016

2. Innovative packaging solutions of 3D system in package with antenna integration for IoT and 5G application, 2018 IEEE 20th Electron;Tsai;Packag. Technol. Conf. EPTC,2018

3. Ultra large area SIPs and integrated mmW antenna array module for 5G mmWave outdoor applications;Talebbeydokhti,2019

4. Heterogeneous integration of double side SiP for IoT and 5G application;Tsai,2021

5. A highly integrated on-line monitoring system for RF applications;Ji,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling;Soldering & Surface Mount Technology;2024-03-18

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