Innovative EMI Shielding Solutions on Advanced SiP Module for 5G Application-Reference-Cited by-同舟云学术

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Innovative EMI Shielding Solutions on Advanced SiP Module for 5G Application

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Author:

Tsai Mike,Chiu Ryan,He Eric,Chen J. Y.,Chu Frank,Tsai Jensen,Wang Yu-Po,Jian Shunyu,Chen Simon

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026564.pdf?arnumber=9026564

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Conductive water-based graphene suspension for electromagnetic interference shielding via spray coating on SiP module;Progress in Organic Coatings;2024-10

2. Difference Frequency of EMI Shielding Solutions for SiP Module;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

3. Rational design of graphene/polymer composites with excellent electromagnetic interference shielding effectiveness and high thermal conductivity: a mini review;Journal of Materials Science & Technology;2022-08

4. Binary hybrid filler composite formulations of surface modified Fe–Si–Al alloys for multifunctional EMI shielding and thermal conduction;Materials Chemistry and Physics;2022-05

5. EMI Shielding Materials and Absorbers for 5G Communications;Advanced Materials and Components for 5G and Beyond;2022

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