Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application-Reference-Cited by-同舟云学术

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Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Tsai Mike,Chiu Ryan,Huang Dick,Kao Feng,He Eric,Chen J. Y.,Chen Simon,Tsai Jensen,Wang Yu-Po

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811357.pdf?arnumber=8811357

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Virtual metrology in semiconductor manufacturing: Current status and future prospects;Expert Systems with Applications;2024-09

2. Ultra-thin Double Side SiP Technology with Embedded Trace Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules;IEEE Transactions on Electron Devices;2023-01

5. The Microwave Test and Measurement System for On-wafer Investigation under Irradiation;2022 Moscow Workshop on Electronic and Networking Technologies (MWENT);2022-06-09

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