Author:
Chae MyoungSu,Ouyang Eric
Cited by
12 articles.
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1. From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to Warpage;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
2. Study on the Key Technology in FC-SiP Packaging with 4L ETS Substrate;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Novel Approach To Resolve Strip Camber At Assembly Process Of Semiconductor Packaging;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
4. Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles;ACS Applied Materials & Interfaces;2023-01-25
5. MIS Strip Warpage Improvement By FEA Study;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19