Study on the Key Technology in FC-SiP Packaging with 4L ETS Substrate-Reference-Cited by-同舟云学术

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Study on the Key Technology in FC-SiP Packaging with 4L ETS Substrate

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Li Xiaoyan¹,Tong Xinxin¹,Yang Hongqiang¹,Zhao Qingfeng¹,Li Guangyao²,Chen Yang¹,Fang Jianmin¹

Affiliation:

1. Sanechips Technology Co., Ltd.,Department of Packaging and Testing,Shenzhen,China

2. ZTE Corporation,State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492297.pdf?arnumber=10492297

Reference5 articles.

1. The Study of Warpage of an Embedded Substrate of the Flip Chip Chip Size Package

2. Challenge and warpage optimization of thermal compression bonding technology on coreless substrates

3. Strip warpage analysis of a flip chip package considering the mold compound processing parameters

4. Balanced embedded trace substrate design for warpage control

5. An embedded trace FCCSP substrate without glass cloth

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