An embedded trace FCCSP substrate without glass cloth-Reference-Cited by-同舟云学术

An embedded trace FCCSP substrate without glass cloth

Published:2016-02 Issue: Volume:57 Page:101-110
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chao Shin-Hua,Hung Chih-Ping,Chen Mark,Lee Youru,Huang Joey,Kao Golden,Luh Ding-Bang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

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3. Coreless packaging technology for high-performance application;Nishitani,2012

4. Warpage issues and assembly challenges using coreless package substrate;Kim,2012

5. Coreless substrate with asymmetric design to improve package warpage;Lin,2014

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