Stress Analysis of the Low-k Layer in a Flip-Chip Package with an Oblong Copper Pillar Bump
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Published:2017-08-01
Issue:8
Volume:9
Page:1139-1145
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ISSN:1941-4900
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Container-title:Nanoscience and Nanotechnology Letters
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language:en
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Short-container-title:nanosci nanotechnol lett
Author:
Song Cha Gyu,Kwon Oh Young,Jung Hoon Sun,Sohn EunSook,Choa Sung-Hoon
Publisher
American Scientific Publishers
Subject
General Materials Science