Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding-Reference-Cited by-同舟云学术

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Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Schulze Sebastian,Wietstruck Matthias,Fraschke Mirko,Kerepesi Peter,Kurz Helmut,Rebhan Bernhard,Kaynak Mehmet

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811170.pdf?arnumber=8811170

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. CMOS-Compatible Fine Pitch Al-Al Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Bonding Processing and 3D Integration of High-Performance Silicon PIN Detector for ΔE-E telescope;Processes;2023-02-18

3. Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electronics Packaging;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

4. Electroplated Al Press Marking for Wafer-Level Bonding;Micromachines;2022-07-30

5. Two-Step Ar/N₂ Plasma-Activated Al Surface for Al-Al Direct Bonding;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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