CMOS-Compatible Fine Pitch Al-Al Bonding
Author:
Affiliation:
1. Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR),Singapore
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195413.pdf?arnumber=10195413
Reference24 articles.
1. Atomic diffusion bonding of wafers with thin nanocrystalline metal films
2. Low power microelectronics: retrospect and prospect
3. Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications
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3. Cu-Cu Hybrid Bonding;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
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