The Simulated TDR Impedance In PCB Material Characterization
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9559133/9559134/09559341.pdf?arnumber=9559341
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Surface Roughness Effect From Different Surfaces of Microstrip Lines and Reference Plane;IEEE Letters on Electromagnetic Compatibility Practice and Applications;2023-09
2. Insertion Loss Reduction Using Rounded Corners to Mitigate Surface Roughness Effect in PCB Transmission Lines;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01
3. Dielectric Loss Tangent Extraction Using Two Single-ended Striplines of Different Width;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
4. Extraction of Stripline Surface Roughness Using Cross-section Information and S-parameter Measurements;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
5. Far-End Crosstalk Modeling and Prediction for Stripline With Inhomogeneous Dielectric Layers (IDLs);IEEE Transactions on Signal and Power Integrity;2022
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