Surface Roughness Effect From Different Surfaces of Microstrip Lines and Reference Plane
Author:
Affiliation:
1. Electromagnetic Compatibility Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
2. Data Center Group, Intel Corporation, Hillsboro, OR, USA
Funder
National Science Foundation
Intel Corporation, Hillsboro, OR, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Medicine
Link
https://ieeexplore.ieee.org/ielam/8566057/10260712/10126084-aam.pdf
Reference14 articles.
1. Dielectric Dissipation Factor (DF) Extraction Based on Differential Measurements and 2-D Cross-sectional Analysis
2. Quantification of Conductor Surface Roughness Profiles in Printed Circuit Boards
3. S-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures
4. Practical method for modeling conductor surface roughness using close packing of equal spheres;simonovich;Proc DesignCon,2015
5. Advanced Signal Integrity for High-Speed Digital Designs
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