Influence of temperature and humidity on adhesion of underfills for flip chip packaging
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/6144/30452/01402617.pdf?arnumber=1402617
Cited by 44 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review;The Journal of Adhesion;2024-05-09
2. Changes in the structure and physical properties of acrylic and epoxy adhesives in response to high-temperature and high-humidity environments;Results in Materials;2024-03
3. Probing molecular structures at buried solid/solid interfaces involving low-k materials or polymers in situ nondestructively: a review;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-03-02
4. Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables;Microelectronics Reliability;2022-05
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