Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables

Author:

Yang Ying,Toure Mamadou Kabirou,Souare Papa Momar,Duchesne Eric,Sylvestre Julien

Funder

IBM Canada Ltd

Natural Sciences and Engineering Research Council of Canada

International Business Machines Corporation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference56 articles.

1. Effects of surface-modified alkyl chain length of silica fillers on the rheological and thermal mechanical properties of underfill;Guo;IEEE Trans. Compon. Packag. Manuf. Technol.,2016

2. Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures;Sun,2020

3. Underfill delamination to chip sidewall in advanced flip chip packages;Paquet,2009

4. Interlayer dielectric cracking in back end of line (BEOL) stack;Raghavan,2012

5. Impact of underfill fillet geometry on interfacial delamination in organic flip chip packages;Kacker,2006

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