Author:
Yang Ying,Toure Mamadou Kabirou,Souare Papa Momar,Duchesne Eric,Sylvestre Julien
Funder
IBM Canada Ltd
Natural Sciences and Engineering Research Council of Canada
International Business Machines Corporation
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference56 articles.
1. Effects of surface-modified alkyl chain length of silica fillers on the rheological and thermal mechanical properties of underfill;Guo;IEEE Trans. Compon. Packag. Manuf. Technol.,2016
2. Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures;Sun,2020
3. Underfill delamination to chip sidewall in advanced flip chip packages;Paquet,2009
4. Interlayer dielectric cracking in back end of line (BEOL) stack;Raghavan,2012
5. Impact of underfill fillet geometry on interfacial delamination in organic flip chip packages;Kacker,2006
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献