Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter
Author:
Affiliation:
1. University of Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences,Shenzhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873346.pdf?arnumber=9873346
Reference14 articles.
1. Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications
2. Study on influence of environment on adhesion performance of underfill for flip chip application;luo;International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458),2000
3. Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers
4. Influence of temperature and humidity on adhesion of underfills for flip chip packaging;luo;2001 Proceedings 51st Electronic Components and Technology Conference (Cat No 01CH37220),2001
5. Elastic modulus variation due to moisture absorption and permanent changes upon redrying in an epoxy based underfill
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