Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering
Reference22 articles.
1. Disigning with Plastic and Composites;Rosato,1991
2. Thermo-physical characterisation of epoxy resin reinforced by amino-functionalized carbon nanofibers;Prolongo;Composites Science and Technology,2009
3. A study on rheological behavior of MWCNTs/epoxy composites;Park;Journal of Industrial and Engineering Chemistry,2010
4. Synthesis and characterization of imide ring and siloxane-containing cycloaliphatic epoxy resins;Tao;European Polymer Journal,2007
5. Preparation and properties of POSS/epoxy composites for electronic packaging applications;Rashid;Materials and Design,2009
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