Study on Silane Coupling Agent Treated Silica Nanoparticles Filled High Performance Copper Clad Laminate
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s13391-023-00446-z.pdf
Reference44 articles.
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2. Kuo, Y., Chen, S.-H.: Parameters Adjustment optimization for Prepreg of copper clad Laminate based on virtual metrology. Appl. Sci. 10, 8488 (2020)
3. Ge, M., Zhang, J., Zhao, C., Lu, C., Du, G.: Effect of hexagonal boron nitride on the thermal and dielectric properties of polyphenylene ether resin for high-frequency copper clad laminates. Mater. Des. 182, 108028 (2019)
4. Kim, Y.H., Lim, Y.W., Kim, Y.H., Bae, B.S.: Thermally stable siloxane hybrid matrix with low dielectric loss for copper-clad laminates for high-frequency applications. ACS Appl. Mater. Interfaces. 8, 8335–8340 (2016)
5. Wu, B., Mao, X., Xu, Y., Li, R., Wu, N., Tang, X.: Improved dielectric and thermal properties of core-shell structured SiO2/polyolefin polymer composites for high-frequency copper clad laminates. Appl. Surf. Sci. 544, 148911 (2021)
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