Improved dielectric and thermal properties of core-shell structured SiO2/polyolefin polymer composites for high-frequency copper clad laminates-Reference-Cited by-同舟云学术

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Improved dielectric and thermal properties of core-shell structured SiO2/polyolefin polymer composites for high-frequency copper clad laminates

Published:2021-04 Issue: Volume:544 Page:148911
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Wu Bo,Mao Xin,Xu Yi,Li Rong,Wu Nan,Tang Xianzhong

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference35 articles.

1. Study on low dielectric laminate modified by hyperbranched polyester of caprylic acid and hexanoic acid co-blocking;Shi;J. Mater. Sci-Mater. El.,2020

2. Thermally stable siloxane hybrid matrix with low dielectric loss for copper-clad laminates for high-frequency applications;Kim;ACS Appl. Mater. Inter.,2016

3. Review of polymer materials with low dielectric constant;Zhao;Polym. Int.,2010

4. Epoxy nanocomposites: Improved thermal and dielectric properties by benzoxazinyl modified polyhedral oligomeric silsesquioxane;Zhang;Mater. Chem. Phys.,2019

5. Developing high performance cyanate ester resin with significantly reduced postcuring temperaturewhile improved toughness, rigidity, thermal and dielectric properties based on manganese-Schiff base hybridized graphene oxide;Gu;Chem. Eng. J.,2016

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3. Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications;Polymers;2024-02-17

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