The effect of filler gradation on the flow length of Underfill-Reference-Cited by-同舟云学术

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The effect of filler gradation on the flow length of Underfill

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Qiang Qianqian¹,Du Xiaomeng¹,Yang Liu¹,Zhang Leicong¹,Zhao Tao¹,Zhu Pengli¹,Sun Rong¹,Wang Ning¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872660.pdf?arnumber=9872660

Reference8 articles.

1. Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle

2. Underfill viscous flow between parallel plates and solder bumps

3. Flow time measurements for underfills in flip-chip packaging

4. Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion

5. Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications

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