Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle-Reference-Cited by-同舟云学术

Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle

Published:2002-02 Issue:2 Volume:42 Page:293-299
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wang Jinlin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Underfill flow as viscous flow between parallel plates driven by capillary action;Schwiebert;IEEE Trans Components Packag Manuf Technol—Part C,1996

2. A study of underfill dispensing process;Chia;Int J Microcirc Electron Packag,1999

3. Underflow process for direct-chip-attachment packaging;Lehmann;IEEE Trans Components Packag Manuf Technol—Part A,1998

4. Mechanics of fluids;Shames,1982

5. The dynamic of capillary flow;Washburn;Phys Rev,1921

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