A Novel Equivalent Model for Underfill Molding Process On 2.2D Structure for High Performance Applications
Author:
Affiliation:
1. CoreTech System (Moldex3D),Zhupei,Taiwan, R.O.C.
2. SiPlus Co.,Hsinchu,Taiwan, R.O.C.
3. iST-Integrated Service Technology Inc.,Hsinchu,Taiwan, R.O.C.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816707.pdf?arnumber=9816707
Reference18 articles.
1. An Examination of Underfill Flow in Large Dies With Nonuniform Bump Patterns
2. The Dynamics of Capillary Flow
3. Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
4. An analytical model for predicting the underfill flow characteristics in flip-chip encapsulation
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Hybrid Numerical Simulation for Capillary Underfill Flow Over a Fine Pitch HBM Packaging;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. In-situ Observation of Underfill Dispensing Process;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
4. A Novel Modelling Methodology for Underfill Molding Process On 2.2D Heterogeneous Integrated Substrate;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
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