Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process-Reference-Cited by-同舟云学术

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Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Sun Chia-Peng¹,Liang Yu-En¹,Hu Dyi-Chung²,Chen Er-Hao³,Lee Jeffrey ChangBing⁴,Vallury Srikar⁵

Affiliation:

1. CoreTech System (Moldex3D),Product R&D Division,Zhubei City,Taiwan, R.O.C.

2. SiPlus Co.,CEO,Hsinchu,Taiwan, R.O.C.

3. SiPlus Co.,CEO Department,Hsinchu,Taiwan, R.O.C.

4. Integrated Service Technology Inc,Global Engineering Development Division,Hsinchu,Taiwan, R.O.C.

5. Moldex3D North America, Inc.,Detroit,United States

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195726.pdf?arnumber=10195726

Reference10 articles.

1. A New Analysis of the Capillary Driving Pressure for Underfill Flow in Flip-Chip Packaging

2. A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process

3. 2.2D Die last Integrated Substrate for High Performance Applications

4. A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

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