Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion-Reference-Cited by-同舟云学术

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Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion

Published:1998-06 Issue:2 Volume:21 Page:360-364
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Wong C.P.,Vincent M.B.,Shi S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/15246/00705485.pdf?arnumber=705485

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal expansion and mechanical properties of urethane-modified epoxy bonded CFRP/steel joints at low and high temperatures for automotive;Composite Structures;2023-10

2. The effect of filler gradation on the flow length of Underfill;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Nanocomposite Materials Properties of Aminophenylsilsesquioxanes;New Polymeric Materials Based on Element-Blocks;2018-12-23

4. Properties of nano-sized synthetic diamond and boron nitride filled different types of epoxy resin;Journal of Materials Science: Materials in Electronics;2015-09-04

5. Nano-sized boron nitride epoxy composites for underfill application: effect of diluent and filler loading;Journal of Materials Science: Materials in Electronics;2014-11-01

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