Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers-Reference-Cited by-同舟云学术

Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers

Published:2014-04 Issue:4 Volume:54 Page:833-839
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kim Sanwi,Kim Taek-Soo

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference58 articles.

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5. A new approach for thermal fatigue testing of the underfill/passivation interface;Gurumurthy;ASME APPLIED MECHANICS DIVISION-PUBLICATIONS-AMD,1997

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