Elastic modulus variation due to moisture absorption and permanent changes upon redrying in an epoxy based underfill
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/6144/33636/01599499.pdf?arnumber=1599499
Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. Effect of moisture absorption on the thermo-mechanical properties of carbon/epoxy composites with SiC reinforcement;Composite Interfaces;2022-05-01
3. A tensile test for freestanding low-k thin films using a lift-off technique;Microelectronic Engineering;2022-02
4. Viscoelastic and mechanical properties of CNT-reinforced polymer-based hybrid composite materials using hygrothermal creep;Polymers and Polymer Composites;2021-11
5. In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging;Journal of Thermal Analysis and Calorimetry;2021-06-25
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