A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias-Reference-Cited by-同舟云学术

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A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias

Published:2008-05 Issue:2 Volume:31 Page:267-274
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Oo Zaw Zaw,Liu En-Xiao,Li Er-Ping,Wei Xingchang,Zhang Yaojiang,Tan Mark,Li Le-Wei Joshua,Vahldieck RÜdiger

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4512103/04512110.pdf?arnumber=4512110

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Analytical Models of Passive Linear Structures in Printed Circuit Boards;Chinese Journal of Electronics;2021-03

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4. Fast and Accurate Calculation of System-Level ESD Noise Coupling to a Signal Trace by PEEC Model Decomposition;IEEE Transactions on Microwave Theory and Techniques;2017-01

5. A novel lumped-parameter model of crosstalk between vias in high-speed PCBS;Microwave and Optical Technology Letters;2016-06-27

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