Analytical Models of Passive Linear Structures in Printed Circuit Boards-Reference-Cited by-同舟云学术

Analytical Models of Passive Linear Structures in Printed Circuit Boards

Published:2021-03 Issue:2 Volume:30 Page:275-281
ISSN:1022-4653
Container-title:Chinese Journal of Electronics
language:en
Short-container-title:Chin. j. electron.

Author:

Zhenzhen Peng¹,Donglin Su¹²

Affiliation:

1. The School of Electronic and Information EngineeringBeihang UniversityBeijing100191China

2. The Research Institute for Frontier ScienceBeihang UniversityBeijing100191China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Applied Mathematics,Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/cje.2020.08.017

Reference32 articles.

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2. V.StojanovicandM.Horowitz “Modeling and analyst is of high‐speed links” Proceeding of IEEE Custom Integrated Circuits Conference San Jose CA USA pp.589—594 2003.

3. Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique

4. “Modeling of multiple scattering among vias in planar waveguides using Foldy–Lax equations”;Tsang L.;Microwave and Optical Technology Letters,2004

5. A.E.Engin K.BharathandM.Swaminathan etal “Finite‐difference modeling of noise coupling between power/ground planes in multilayered packages and boards” Proceeding 56th Electronic Components and Technology Conference pp.1262—1267 2006.

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