A novel lumped-parameter model of crosstalk between vias in high-speed PCBS-Reference-Cited by-同舟云学术

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A novel lumped-parameter model of crosstalk between vias in high-speed PCBS

Published:2016-06-27 Issue:9 Volume:58 Page:2088-2090
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw. Opt. Technol. Lett.

Author:

Cheng Weichang¹,Xu Shen¹,Yu Juzheng¹,Sun Weifeng¹

Affiliation:

1. National ASIC System Engineering Research Center; Southeast University; Nanjing Jiangsu 210096 People's Republic of China

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane;Tsang;IEEE Trans Adv Package,2003

2. Full-wave characterization of a through hole via in multi-layered packaging;Hsu;IEEE Trans Microw Theory Tech,1995

3. J. Zhang Q. Chen Z. Yang J. Drewniak A. Orlandi 2010

4. A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias;Oo;IEEE Trans Adv Packag,2008

5. Capacitance calculation for via structures using an integral equation method based on partial capacitance;Wang;IEEE Trans Compon Packag Manuf Technol,2013

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