A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate With a Flip-Chip Interconnection-Reference-Cited by-同舟云学术

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A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate With a Flip-Chip Interconnection

Published:2009-02 Issue:1 Volume:32 Page:101-108
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Song Sangsub,Kim Youngmin,Maeng Jimin,Lee Heeseok,Kwon Youngwoo,Seo Kwang-Seok

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4785297/04785319.pdf?arnumber=4785319

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29

2. Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design;Lecture Notes in Electrical Engineering;2020

3. State-of-the-Art Approach: System-on-Package;Smart Sensors, Measurement and Instrumentation;2019

4. High-Fidelity, High-Performance Computational Algorithms for Intrasystem Electromagnetic Interference Analysis of IC and Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-05

5. Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-04

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