Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies-Reference-Cited by-同舟云学术

Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

Published:2017-04 Issue:4 Volume:7 Page:494-501
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Weimann Nils G.^ORCID,Monayakul Sirinpa,Sinha Siddhartha,Schmuckle Franz-Josef,Hrobak Michael,Stoppel Dimitri,John Wilfred,Kruger Olaf,Doerner Ralf,Janke Bernd,Krozer Viktor,Heinrich Wolfgang

Funder

German Ministry of Research within the VIP project AVTE

German National Aeronautics and Space Research Centre under project MIMIRAWE

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/7903751/07819460.pdf?arnumber=7819460

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