State-of-the-Art Approach: System-on-Package
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-14690-0_8
Reference53 articles.
1. Tummala RR, Swaminathan M. System-on-package: miniaturization of the entires. 1st ed. New York: McGraw-Hill Professional; 2008.
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3. Lee YC, Park CS. LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications. Int J RF Microwave Comput Aided Eng. 2016;26(9):803–11.
4. Dong M, Santagata F, Sokolovskij R, Wei J, Yuan C, Zhang G. 3D system-in-package design using stacked silicon submount technology. Microelectron Int. 2015;32(2):63–72.
5. Huang S, DeLaCruz J. Improvements of system-in-package integration and electrical performance using BVA wire bonding. IEEE Trans Compon Packag Manuf Technol. 2017;7(7):1020–34.
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