LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications-Reference-Cited by-同舟云学术

LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications

Published:2016-08-25 Issue:9 Volume:26 Page:803-811
ISSN:1096-4290
Container-title:International Journal of RF and Microwave Computer-Aided Engineering
language:en
Short-container-title:Int. J. RF Microw. Comput. Aided Eng.

Author:

Lee Young Chul¹,Park Chul Soon²

Affiliation:

1. Department of Electronic Engineering; Mokpo National Maritime University; Mokpo-si South Korea

2. Department of Electrical Engineering; KAIST; Daejeon South Korea

Funder

Ministry of Science and Technology of Korea and KISTEP

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Reference23 articles.

1. Kaixue MA 2014

3. Kamgaing T Elsherbini AA Oster SN Rawlings BM Lee K-O. 2015

5. Tobias K Matthias F Reinhard K Christian R. 1285 1288 2012

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