Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics-Reference-Cited by-同舟云学术

Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics

Published:2022-04 Issue:4 Volume:12 Page:682-691
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Konstantinou Xenofon¹^ORCID,Albrecht John D.¹^ORCID,Chahal Premjeet¹,Papapolymerou John¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA

Funder

Honeywell Federal Manufacturing & Technologies, LLC which manages and operates the Department of Energy’s National Security Campus

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference32 articles.

1. Ultra wideband 3D interconnects using aerosol jet printing up to 110 GHz;qayyum;Proc 12th Eur Microw Integr Circuits Conf (EuMIC),2017

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