Author:
Konstantinou Xenofon,Craton Michael Thomas,Albrecht John D.,Papapolymerou John
Cited by
3 articles.
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1. Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-04
2. Towards High-Power Multipliers Using Diamond Schottky Barrier Diodes;2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS);2021-11-01
3. Ultra-Wideband Transmission Lines on Complex Structures via Extendable Aerosol Jet 3D-Printing;2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS);2021-11-01