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Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy

  • Published:2021-06 Issue:6 Volume:31 Page:697-700
  • ISSN:1531-1309
  • Container-title:IEEE Microwave and Wireless Components Letters
  • language:
  • Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Craton Michael ThomasORCID,Albrecht John D.,Chahal Premjeet,Papapolymerou JohnORCID

Funder

Honeywell Federal Manufacturing & Technologies, LLC which manages and operates the Department of Energy’s National Security Campus

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs;2024 IEEE Wireless and Microwave Technology Conference (WAMICON);2024-04-15

3. 3D Freeform Millimeter-Wave and THz Structures Based on Multi-Photon Lithography;Optical Fiber Communication Conference (OFC) 2024;2024

4. A New Method for Improving Return Loss in Additively Integrated Bare Die Amplifiers;2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI);2023-07-23

5. Process considerations for Aerosol-Jet printing of ultra fine features;Flexible and Printed Electronics;2023-07-20
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