Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs
Author:
Affiliation:
1. University of South Florida,Center for Wireless and Microwave Information Systems,Department of Electrical Engineering,Tampa,FL,USA
Funder
Army Research Laboratory
L3Harris Technologies
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10522823/10522798/10522864.pdf?arnumber=10522864
Reference8 articles.
1. Antenna Design Using Modern Additive Manufacturing Technology: A Review
2. Embedded Actives Using Additive Manufacturing for High-Density RF Circuits and Systems
3. Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy
4. How 3D-Printing Is Changing RF Front-End Design for Space Applications
5. 3D Printed Wideband Multilayered Dual-Polarized Stacked Patch Antenna With Integrated MMIC Switch
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