A New Method for Improving Return Loss in Additively Integrated Bare Die Amplifiers
Author:
Affiliation:
1. University of Massachusetts,Lowell,USA
2. Raytheon Technologies,Andover,Massachusetts,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10237348/10237371/10237680.pdf?arnumber=10237680
Reference6 articles.
1. A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing
2. Fully Aerosol Jet Printed Interconnects and Fill Materials for Millimeter Wave Circuits
3. A review of hybrid couplers: State‐of‐the‐art , applications, design issues and challenges
4. Additive Manufacturing of a Wideband Capable W-Band Packaging Strategy
5. Comparison of Additive Manufacturing Methods for the Attachment of Bare Die to Printed Circuit Boards
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