Funder
Honeywell Federal Manufacturing & Technologies, LLC which manages and operates the Department of Energy’s National Security Campus
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A 3-D Heterogeneously Integrated Application of the RF-Module With Micro-Bump Filter and Embedded AiP at W-Band;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
2. Additively Manufactured RF Interconnects for D-Band/sub-THz Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04
4. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29
5. Additive Integration with Aerosol-Jet Printed SIWs;2023 53rd European Microwave Conference (EuMC);2023-09-19